1. 2. 3. material content data sheet sales product name tle7238sl issued 28. august 2013 ma# MA000982080 package pg-ssop-24-5 weight* 147.47 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 7.437 5.04 5.04 50432 50432 leadframe inorganic material phosphorus 7723-14-0 0.016 0.01 106 non noble metal zinc 7440-66-6 0.062 0.04 422 non noble metal iron 7439-89-6 1.245 0.84 8445 non noble metal copper 7440-50-8 50.568 34.29 35.18 342900 351873 wire noble metal gold 7440-57-5 0.589 0.40 0.40 3997 3997 encapsulation organic material carbon black 1333-86-4 0.166 0.11 1126 plastics epoxy resin - 7.642 5.18 51817 inorganic material silicondioxide 60676-86-0 75.253 51.04 56.33 510287 563230 leadfinish non noble metal tin 7440-31-5 1.680 1.14 1.14 11391 11391 plating noble metal silver 7440-22-4 0.365 0.25 0.25 2477 2477 glue plastics acrylic resin - 0.539 0.37 3652 noble metal silver 7440-22-4 1.909 1.29 1.66 12948 16600 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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